CHI EA ’25
Title: Magneto: Enabling Multimodal Haptic Feedback on Paper through Magnetic Fields
Authors: Park, J., Shin, S., Kang, S., Kim, G., and Kim, S.
Conference: CHI EA ’25: Extended Abstracts of the CHI Conference on Human Factors in Computing Systems
CHI ’25
Title: TelePulse: Enhancing the Teleoperation Experience through Biomechanical Simulation-Based Electrical Muscle Stimulation in Virtual Reality
Authors: Hwang, S., Kang, S., Oh, J., Park, J., Shin, S., Luo, Y., DelPreto, J., Matusik, W., Rus, D., and Kim, S.
Conference: CHI ’25: ACM Conference on Human Factors in Computing Systems
Awards: 🏆 Best Paper (Top 1%)
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UIST ’24
Title: Flip-Pelt: Motor-Driven Peltier Elements for Rapid Thermal Stimulation and Congruent Pressure Feedback in Virtual Reality
Authors: Kang, S., Kim, G., Hwang, S., Park, J., Elsharkawy, A., and Kim, S.
Conference: The 37th Annual ACM Symposium on User Interface Software and Technology (UIST ’24), Pittsburgh, PA, USA
UbiComp Companion 2024
Title: Proposal of a Framework for Enhancing Teleoperation Experience with Biomechanical Simulation-Based Electrical Muscle Stimulation in Virtual Reality
Authors: Hwang, S., Kang, S., Oh, J., Park, J., Shin, S., Luo, Y., DelPreto, J., Matusik, W., Rus, D., and Kim, S.
Conference: UbiComp Companion 2024
2024 IEEE ICRA Workshop on Wearable
Title: Dual-sided Peltier Elements for Rapid Thermal Feedback in Wearables
Authors: Kang, S., Kim, G., Hwang, S., Park, J., Elsharkawy, A., and Kim, S.
Conference: 2024 IEEE ICRA Workshop on Wearable
A wearable translator for finger sign language, designed for real-time bidirectional communication with hearing-impaired individuals.
